04.05.2021 •

The Future of Neuroscience: Flexible and Wireless Implantable Neural Electronics

Abstract

Neurological diseases are a prevalent cause of global mortality and are of growing concern when considering an ageing global population. Traditional treatments are accompanied by serious side effects including repeated treatment sessions, invasive surgeries, or infections. For example, in the case of deep brain stimulation, large, stiff, and battery powered neural probes recruit thousands of neurons with each pulse, and can invoke a vigorous immune response. This paper presents challenges in engineering and neuroscience in developing miniaturized and biointegrated alternatives, in the form of microelectrode probes. Progress in design and topology of neural implants has shifted the goal post toward highly specific recording and stimulation, targeting small groups of neurons and reducing the foreign body response with biomimetic design principles. Implantable device design recommendations, fabrication techniques, and clinical evaluation of the impact flexible, integrated probes will have on the treatment of neurological disorders are provided in this report. The choice of biocompatible material dictates fabrication techniques as novel methods reduce the complexity of manufacture. Wireless power, the final hurdle to truly implantable neural interfaces, is discussed. These aspects are the driving force behind continued research: significant breakthroughs in any one of these areas will revolutionize the treatment of neurological disorders.

Full Open Access review article:

Advanced Science

Source: Preview Image: enot poloskun/Getty Images

Related articles

In Situ Derived Mixed Ion/Electron Conducting Layer on Top of a Functional Separator for High-Performance, Dendrite-Free Rechargeable Lithium-Metal Batteries
  Access
  now
Article Digest

In Situ Derived Mixed Ion/Electron Conducting Layer on Top of a Functional Separator for High-Performance, Dendrite-Free Rechargeable Lithium-Metal Batteries

Rechargeable lithium-metal batteries (RLBs) face cycling and safety challenges due to reactive Li and uncontrolled dendrite growth. This study introduces an Mg3N2-decorated separator for Li-metal surfaces to enhance anode electrochemistry. This scalable approach promises high-energy RLBs with extended cycles and improved safety, offering new battery manufacturing possibilities.
Channel-Length Independent Electrical Characteristics of Oxide Thin-Film Transistors
Article Digest

Channel-Length Independent Electrical Characteristics of Oxide Thin-Film Transistors

The quality and dimensions of the fabricated devices were assessed through an MX61 optical microscope from Olympus.
Flexible Thin-Film Electronics
Article Digest

Flexible Thin-Film Electronics

Fast-forward and electronics are ubiquitous throughout our lives. Most electronic devices are composed of rigid circuit boards containing electronic components (e.g., transistors, resistors, and capacitors), and printed metallic interconnects. Now, flexible electronics are currently being developed for next-generation devices.
Native Oxide Barrier Layer for Selective Electroplated Metallization of Silicon Heterojunction Solar Cells
Article Digest

Native Oxide Barrier Layer for Selective Electroplated Metallization of Silicon Heterojunction Solar Cells

An alternative low-silver approach for low-temperature metallization of SHJ solar cells through selectivity of etchants and plating processes was demonstrated. The NOBLE approach saves processing steps and consumables with encouraging results.
Phase Separation-Controlled Assembly of Hierarchically Porous Aramid Nanofiber Films for High-speed Lithium-Metal Batteries
  Access
  now
Article Digest

Phase Separation-Controlled Assembly of Hierarchically Porous Aramid Nanofiber Films for High-speed Lithium-Metal Batteries

This study shows that hierarchically porous aramid nanofiber separators effectively inhibit lithium dendrite growth, ensuring stable high-rate cycle performances, and addressing Li-metal battery lifespan and safety.
Film Adhesion of Flexible Electronics Influenced by Interlayers
Article Digest

Film Adhesion of Flexible Electronics Influenced by Interlayers

Compression-induced delamination is a technique that uses the buckling dimensions to evaluate the interfacial adhesion of materials on flexible substrates quantitatively. This study shows that spontaneous buckles are formed in gold (Au) films, which are deposited without an interlayer. Conversely, external loading is required to delaminate the Au film with the tantalum (Ta) adhesion layer indicating higher adhesion energy.